Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.
The heat dissipation and heat resistance of components required due to the increase in large currents!
- Sealing, Bonding, Mounting Technology, Reliability Evaluation - High-Power Devices: the Advanced Materials and the Mounting Technology ★ The heat dissipation and heat resistance required for components due to increased current! ★ The demand for inverters is rising with the energy-saving of devices and the spread of EVs and HEVs. What are the future technological trends of power devices, which are the core technology!? 【Venue】 Kawasaki City International Exchange Center, Conference Room 1【Kanagawa, Kawasaki】 12 minutes on foot from Motosumiyoshi Station on the Tokyu Toyoko Line Date and Time June 27, 2013 (Thursday) 10:15-16:30
- 企業：AndTech
- 価格：10,000 yen-100,000 yen
